Model

HY-R170

Uses

This hot melt adhesive is mainly used for the bonding and fixation of capacitors on electronic and circuit boards (such as the bonding and fixation of capacitors on electronic and circuit boards, as well as the bonding of various accessories, paper products, and other objects).

Suitable for machinery

Hot melt glue guns with different powers.

Product features

It is a white transparent columnar solid with strong adhesion, anti-aging and excellent performance.

Technical indicators

Application process

Glue spraying | The viscosity during gluing can be adjusted according to temperature; If the temperature cannot be adjusted, the gap for gluing time can be adjusted appropriately.

Matters needing attention

Do not mix with other adhesives.

The hot melt adhesive slot must be tightly covered to prevent debris from falling into and affecting the performance of the adhesive.

Due to the need for heating during the use of hot melt adhesive, personal protective equipment must be worn.

Suggest using the "first in first use" cycle.

Packaging and Storage

Packaging: 20kg/bag

Storage: Store in a cool and dry place and avoid direct sunlight. The storage temperature should be below 40 ℃ and kept away from sources of fire and heat. Unused glue should be immediately sealed and stored.

Note: The color of the product may fluctuate due to different batches of raw materials, but it does not affect the performance of the hot melt adhesive.

Application companies: Midea, Uni President, and Weilong Group.